Semiconductor manufacturer Applied Materials and software and semiconductor design firm Besi are expanding their collaboration on next-generation 3D IC packaging for AI scaling.
Key points
•Next-Gen 3D IC Scaling and Interconnect Tech
•Optimizing Advanced Packaging Flows
•Accelerating Commercialization of Innovations
The companies will extend their cooperation to new interconnect architectures and applications, building upon a joint development program initiated at the Singapore EPIC center. This aims to optimize advanced packaging flows from wafer level to panel scale.
Besi's Kinex™ hybrid bonding integration system developed in 2020 at the Singapore CoE will form the basis of this collaboration. Both companies plan to advance next-generation interconnect technologies for AI and photonic systems, including TCB scaling and die-on-panel integration.
Applied Materials' new EPIC center, a $5 billion investment in advanced semiconductor equipment and process technology R&D within the U.S., is designed to rapidly commercialize innovative technologies from initial research stages through mass production.
